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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
551-90-114-15-063003 Mill-Max Manufacturing Corp. 551-90-114-15-063003 -
RFQ
ECAD 8118 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 114 (15 x 15) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
AR28-HZW/T Assmann WSW Components AR28-HZW/T -
RFQ
ECAD 1774 0.00000000 Assmann WSW Components - Bag Obsolete -40°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame AR28-HZ Wire Wrap download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 3 A Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold - Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - 4mOhm
104-13-648-41-770000 Mill-Max Manufacturing Corp. 104-13-648-41-770000 18.9163
RFQ
ECAD 2908 0.00000000 Mill-Max Manufacturing Corp. 104 Tube Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 104-13 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Thermoplastic - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.175" (4.45mm) -
515-13-273-21-125003 Mill-Max Manufacturing Corp. 515-13-273-21-125003 -
RFQ
ECAD 8780 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 273 (21 x 21) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
AR14-HZL/07-TT Assmann WSW Components AR14-HZL/07-TT -
RFQ
ECAD 6172 0.00000000 Assmann WSW Components - Bag Obsolete -40°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame AR14-HZ Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 33 3 A Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - 4mOhm
01-0503-30 Aries Electronics 01-0503-30 0.5303
RFQ
ECAD 4323 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 01-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB - Gold 30.0µin (0.76µm) Tin 30.0µin (0.76µm) 1 (1 x 1) Beryllium Copper - Brass 0.500" (12.70mm) -
551-90-114-13-061005 Mill-Max Manufacturing Corp. 551-90-114-13-061005 -
RFQ
ECAD 1613 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 114 (13 x 13) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
121-11-950-41-001000 Mill-Max Manufacturing Corp. 121-11-950-41-001000 22.5386
RFQ
ECAD 4385 0.00000000 Mill-Max Manufacturing Corp. 121 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 121-11 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.260" (6.60mm) 10mOhm
126-93-642-41-003000 Mill-Max Manufacturing Corp. 126-93-642-41-003000 21.6311
RFQ
ECAD 1338 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 126-93 Wire Wrap download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.469" (11.91mm) -
248-1282-39-0602J 3M 248-1282-39-0602J -
RFQ
ECAD 6916 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 248 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 48 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
4-1437504-3 TE Connectivity AMP Connectors 4-1437504-3 16.4000
RFQ
ECAD 344 0.00000000 TE Connectivity AMP Connectors * Box Active download ROHS3 Compliant Vendor Undefined REACH info available upon request 2266-4-1437504-3 EAR99 8536.69.4040 5
517-83-265-12-000111 Preci-Dip 517-83-265-12-000111 16.6069
RFQ
ECAD 4952 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 265 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
1109042 Aries Electronics 1109042 66.0186
RFQ
ECAD 1156 0.00000000 Aries Electronics - - Active - - - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
522-93-100-13-061003 Mill-Max Manufacturing Corp. 522-93-100-13-061003 -
RFQ
ECAD 4118 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 100 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
614-93-085-10-031012 Mill-Max Manufacturing Corp. 614-93-085-10-031012 -
RFQ
ECAD 7223 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 85 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
34-0501-20 Aries Electronics 34-0501-20 13.7463
RFQ
ECAD 2058 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 34-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 34 (1 x 34) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
35-0518-10H Aries Electronics 35-0518-10H 3.8380
RFQ
ECAD 4908 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 35-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 35 (1 x 35) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
614-41-428-31-007000 Mill-Max Manufacturing Corp. 614-41-428-31-007000 16.4986
RFQ
ECAD 8190 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Carrier, Open Frame 614-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
917-83-210-41-005101 Preci-Dip 917-83-210-41-005101 1.5418
RFQ
ECAD 4889 0.00000000 Preci-Dip 917 Bulk Active -55°C ~ 125°C Through Hole Transistor, TO-5 - 917-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 330 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 - Gold 29.5µin (0.75µm) Tin - 10 (Round) Beryllium Copper - Brass 0.125" (3.18mm) 10mOhm
42-3575-11 Aries Electronics 42-3575-11 31.5623
RFQ
ECAD 5199 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 42-3575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
216-7383-55-1902 3M 216-7383-55-1902 40.8500
RFQ
ECAD 9716 0.00000000 3M Textool™ Bulk Active -55°C ~ 150°C Through Hole SOIC Closed Frame 216 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES), Glass Filled UL94 V-0 - Gold - Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper - Beryllium Copper 0.140" (3.56mm) -
522-13-096-11-041002 Mill-Max Manufacturing Corp. 522-13-096-11-041002 -
RFQ
ECAD 4212 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 96 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
16-35W000-10 Aries Electronics 16-35W000-10 15.7150
RFQ
ECAD 8634 0.00000000 Aries Electronics Correct-A-Chip® 35W000 Bulk Active - Through Hole - 16-35W0 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead - SOIC-W DIP, 0.3" (7.62mm) Row Spacing 16 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
2-641616-1 TE Connectivity AMP Connectors 2-641616-1 -
RFQ
ECAD 1856 0.00000000 TE Connectivity AMP Connectors Diplomate DL Box Obsolete -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 641616 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1,000 Thermoplastic UL94 V-0 0.100" (2.54mm) Tin - Tin - 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.120" (3.05mm) 30mOhm
AR16-HZL/01-TT Assmann WSW Components AR16-HZL/01-TT -
RFQ
ECAD 7911 0.00000000 Assmann WSW Components - Bag Obsolete -40°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame AR16-HZ Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 29 3 A Thermoplastic, Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - 4mOhm
14-8590-310C Aries Electronics 14-8590-310C 9.4798
RFQ
ECAD 1779 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8590 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
126-91-950-41-002000 Mill-Max Manufacturing Corp. 126-91-950-41-002000 21.2070
RFQ
ECAD 3180 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 126-91 Wire Wrap download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.543" (13.79mm) 10mOhm
116-83-428-41-006101 Preci-Dip 116-83-428-41-006101 2.7927
RFQ
ECAD 7297 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
04-0518-11H Aries Electronics 04-0518-11H 0.9545
RFQ
ECAD 2863 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 04-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 4 (1 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
28-354000-21-RC Aries Electronics 28-354000-21-RC 30.1064
RFQ
ECAD 5204 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 28-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 - Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 28 Beryllium Copper 0.100" (2.54mm) Brass 0.089" (2.28mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse