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Sockets for ICs, Transistors(4545)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Convert From (Adapter End) | Convert To (Adapter End) | Number of Pins | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
01-0518-00 | 8.7315 |  |
5814 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Surface Mount | SIP | Open Frame | 01-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 1 (1 x 1) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.046" (1.17mm) | - | ||||||
|
84-PRS13125-12 | 76.9217 | |
4613 | 0.00000000 | Aries Electronics | PRS | Bulk | Active | -65°C ~ 125°C | Through Hole | PGA, ZIF (ZIP) | Closed Frame | 84-PRS1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS) | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.125" (3.18mm) | - | ||||||
|
145-PGM15024-40 | 39.4818 | |
9519 | 0.00000000 | Aries Electronics | PGM | Bulk | Active | -55°C ~ 105°C | Through Hole | PGA | - | 145-PGM | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.165" (4.19mm) | - | ||||||
|
21-0503-30 | 9.6900 | |
3472 | 0.00000000 | Aries Electronics | 0503 | Bulk | Active | - | Through Hole | SIP | - | 21-0503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA), Nylon, Glass Filled | UL94 HB | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 21 (1 x 21) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.500" (12.70mm) | - | ||||||
|
14-8350-310C | 9.4798 | |
6785 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 14-8350 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
10-6503-20 | 5.2197 | |
3883 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 10-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.360" (9.14mm) | - | ||||||
|
20-651000-10 | 32.8877 | |
9926 | 0.00000000 | Aries Electronics | Correct-A-Chip® 651000 | Bulk | Active | - | Through Hole | - | 20-6510 | Solder | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | - | - | 0.026" (0.65mm) | - | - | Tin-Lead | 200.0µin (5.08µm) | SSOP | DIP, 0.6" (15.24mm) Row Spacing | 20 | - | 0.100" (2.54mm) | Brass | 0.145" (3.68mm) | FR4 Epoxy Glass | |||||
|
22-6501-30 | 7.7527 | |
3200 | 0.00000000 | Aries Electronics | 501 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 22-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.690" (17.52mm) | - | ||||||
|
06-3503-21 | 5.8337 | |
4552 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 06-3503 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.360" (9.14mm) | - | ||||||
|
24-8385-310C | 14.1819 | |
8438 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 24-8385 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
18-8400-310C | 11.4353 | |
7675 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 18-8400 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
36-3571-16 | 48.8311 | |
2130 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 36-3571 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 36 (2 x 18) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | ||||||
 |
1107254-28 | 15.2900 | |
44 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1107254 | Bulk | Active | - | Through Hole | - | 1107254 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | DIP, 0.6" (15.24mm) Row Spacing | DIP, 0.3" (7.62mm) Row Spacing | 28 | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.130" (3.30mm) | - | |||||
|
10-2501-21 | 6.8478 | |
1806 | 0.00000000 | Aries Electronics | 501 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.2" (5.08mm) Row Spacing | Closed Frame | 10-2501 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 10 (2 x 5) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.410" (10.41mm) | - | ||||||
|
15-0508-31 | 10.8352 | |
3905 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 125°C | Through Hole | SIP | - | 15-0508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6 | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 15 (1 x 15) | Beryllium Copper | - | Brass | 0.500" (12.70mm) | - | ||||||
|
42-6575-11 | 31.5623 | |
9740 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||||||
|
69-PRS13112-12 | 74.3117 | |
1854 | 0.00000000 | Aries Electronics | PRS | Bulk | Active | -65°C ~ 125°C | Through Hole | PGA, ZIF (ZIP) | Closed Frame | 69-PRS1 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS) | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | - | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.125" (3.18mm) | - | ||||||
|
28-8240-610C | 16.0982 | |
9748 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 28-8240 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
40-8625-610C | 22.1379 | |
3876 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 40-8625 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||||||
|
28-652000-11-RC | 45.2512 | |
7832 | 0.00000000 | Aries Electronics | Correct-A-Chip® 652000 | Bulk | Active | - | Through Hole | - | 28-6520 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 17 | 1 A | - | - | 0.050" (1.27mm) | - | - | Gold | 10.0µin (0.25µm) | PLCC | DIP, 0.6" (15.24mm) Row Spacing | 28 | - | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | FR4 Epoxy Glass | |||||
 |
40-526-10 | 15.1800 | |
37 | 0.00000000 | Aries Electronics | Lo-PRO®file, 526 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, ZIF (ZIP) | Closed Frame | 40-526 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 11 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 10.0µin (0.25µm) | Tin | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.105" (2.67mm) | - | ||||||
|
28-6553-16 | - | |
4625 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | -55°C ~ 250°C | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 28-6553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 9 | 1 A | Polyetheretherketone (PEEK), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 28 (2 x 14) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | ||||||
|
20-7800-10 | 11.5988 | |
2347 | 0.00000000 | Aries Electronics | 700 | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Carrier, Elevated | 20-7800 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | Q7424755 | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 20 (1 x 20) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | |||||
 |
20-7825-10 | 11.5988 | |
1660 | 0.00000000 | Aries Electronics | 700 Elevator Strip-Line™ | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | Elevated | 20-7825 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1.5 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 20 (1 x 20) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | ||||||
|
08-0518-10T | 0.8363 | |
7918 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 08-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 8 (1 x 8) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
29-0518-00 | 6.4438 | |
5453 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Surface Mount | SIP | Open Frame | 29-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 29 (1 x 29) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.046" (1.17mm) | - | ||||||
|
24-6503-30 | 9.6900 | |
4478 | 0.00000000 | Aries Electronics | 503 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 24-650 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Phosphor Bronze | 0.500" (12.70mm) | - | ||||||
|
14-C280-31 | 13.7297 | |
9772 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 125°C | Surface Mount | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame | 14-C280 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.040" (1.02mm) | - | ||||||
|
08-4513-10T | 0.9545 | |
1800 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.4" (10.16mm) Row Spacing | Closed Frame | 08-4513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||||||
|
40-3554-10 | 15.8718 | |
4947 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 40-3554 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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